IC Storage
A limited service is available to store and vacuum pack bare-die IC’s and wafers with a protective atmosphere (nitrogen) to prevent degradation of unprotected IC’s.
For the shipping or the storage of encapsulated chips in ambient air, a sealing machine is used to package them into ESD bags and under vacuum.
| Technical details | VMS 153 |
|---|---|
| Pump capacity | 21 m3/h |
| Panel | Digital |
| Effective chamber size | 410 x 370 x 170 mm |
| Dimensions, machine | 480 x 515 x 440 mm |
| Power consumption, max | 1,6 kw |
| Power | 230 v – 50/60 hz |
Suitable bags (150um tick) can be purchased from the following suppliers:
For wafers:
Entegris: http://www.devicecare.com
200mm wafers: HWS-ESD-BAG – 13″X15″ METALIZED ESD
For packaged chips:
Compumet: http://www.compumet.ch
Dry-Shield-ESD/EMI bag – JEDEC (Part No.: 3710.DR150.x )
Also provide Silica gel, Moisture indicators…
